bg6bs
:swr部分换电阻的图和rf拆那个三极管 能说一下吗 谢谢
(2016-05-16 14:39) 
相关改动可以参考这里：
https://github.com/df8oe/mchf-github/wiki/Recommended-Modifications RF-04-N-001 PA Overshoot
10uF钽电容与C106并联。（RF板）
RF-04-N-002 PA RX Quiescent Current Reduction
在C96上并联一个1K-2.2K电阻，将C96换成100uF钽电容。（RF板）
UI-04-N-003 Easily Removable/Replacable Display
LCD下面焊接一排插座，便于更换。。。
UI-04-N-004 HY28A Display vs. HY28B Display Changes
拆掉R30，R31和R32。。。（UI板）
RF-04-N-005 I/Q Signal Phase Improvement
C71和C73换成0欧姆电阻。（RF板）
UI-04-N-006 Display Dimming Interference Reduction
C74a换成等值的钽电容。（UI板）
RF-04-N-007 RX Sensitivty Improvement
The PIN diodes for switching the antenna switch is not a low enough through, thereby the sensitivity of the receiver is reduced. As a remedy, is replaced by 220R and R54 22K by 3.9K R53 1K. (another mod is in development where the switching diodes will be replaced with a relay contact)（实在是读不通，反正就是R54和R53换掉。。。釜底抽薪的方法是把二极管换成继电器。。。RF板）
UI-04-N-008 Better Power Supply Filtering
RFC1，RFC2和RFC3换成47uH。（UI板）
RF-04-N-018 RX Sensitivity Improvement
拆掉Q2和R40.（RF板）
UI-04-N-020 Simplified Bootloader Reprogramming
把P6延长出来，免得刷bootloader要拆机。。。（UI板）
RF-04-N-023 SWR Meter Operation Improvment
In the SWR measuring bridge is a design error. The end of the many windings of T3, which now goes to the RF side of the final stage, has to be pulled from his pad again. Next to it is the "correct" line: the MAIN PAGE of the bridge that goes to the BNC connector. You can scrape the conductor next to the toroids and solder the drawn end of the wire there again. This SWR measuring bridge is reliable throughout the operating range of the MCHF.（RF板上T3要改？实在是懒得读。。。）
AG-xx-N-024 Recommendation for connector placement on RF/UI Board
为了互换性和防止短路，建议UI板和RF板的连接口一律改为UI板用针，RF板用孔。
UI-04-N-027 Keyer Input Line ESD Protection Improvement
为防止静电烧MCU，在KEY和MIC的PTT上接齐纳二极管。
RF-04-N-009 PA Self Oscillation Prevention
R81和R82换成100欧的。（RF板）
RF-04-N-010 Reduce Ripple coming from NF PA
懒得读。。。
UI-03-N-001 Adding EEPROM on the old UI Board Rev. 03
03版UI上加EEPROM，忽略。。。
RF-04-N-011 Reduce standby current
R74和R76换成470R的。
拆掉R73和R75。
把R73和R75焊在与基极相连的焊盘上？？（原文solder R73 and R75 upright on the pad that is connected to the base）
在R79与地-基极相连的脚上焊一个100nF电容？？（原文solder a 100nF capacitor upright from the ground-base of R79）
把上述三个的另一只脚 (R73,R75,100nF)焊接到U2的1脚上 (PTT_5V)？？（原文connect the three upright parts (R73,R75,100nF) with U2, pin1 (PTT_5V)）
打问号的都是我不确定的。。。
RF-04-N-012, RF-04-N-022 Correct unsymmetrical ADC in the SWR measurement
R59，R60换成0R。
R58，R62换成2.2K。
C82，C83换成2.2uF。
（RF板）
AG-xx-N-013 Shield between the boards
两块板之间装个屏蔽板。。。
FW-xx-N-014 SI570 autodetect
开机画面自动显示si570的启动频率。。。
RF-04-N-015 Replace T5
RF板上T5重绕：初级5圈，次级4圈，中间抽头。。。
RF-04-N-016 Replace RFC5 and RFC6
RF板上RFC5和RFC6换成0.3mm线在BN43-2402上绕4圈。
UI-04-N-017 5V on USB to use USB for firmware updates
用U盘升级固件，懒得读，还要刷DF8OE的bootloader。
UI-04-N-019 Replace U7 EEProm
UI板上换EEPROM，24LC512 (64kb)，24LC1026 (128kb)和AT24CM02 (256kb)直接换，24LC1025需要短接3脚和8脚。
UI-04-N-025 Switch LCD to SPI mode (Optional, please read the newsgroup)
connect R30/33 to LCD pin 16 (SDO)
connect R31/R34 to LCD pin 17 (SDI)
connect R32/R35 to LCD pin 13 (SCK)
改显示为SPI模式
UI-04-N-026 Activate touchscreen (recommended to use actual FW features)
connect PA4 MCU to LCD TP_IRQ
connect R30/R33 to LCD TP_SDO
connect R31/R34 to LCD TP_SDI
connect R32/R35 to LCD TP_SCK
connect PA9 MCU to LCD TP_CS
改触摸屏
[ 此帖被bg5hgr在2016-05-17 22:46重新编辑 ]
